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Improved Precision

 

Lead floatation of mini-mold components can be precisely inspected by using a combination of colour highlight illumination and newly developed lead extraction logic.

 

Faster Inspection

 

Inspection speed has been increased from approximately 280 ms/image to approximately 240 ms/image with a high-resolution 3-CCD camera and improved software. (Inspection speed may differ depending on the PCB.)

 

Angled View Inspection Function

 

Images are taken along two different optical axes, a direct view and an angled view, using only one camera by changing the axis with special mirrors located between the camera and PCB. Combining these images enables difficult inspections, such as inspecting solder directly under leads. This feature is also effective for inspecting PLCC, SOJ, and similar chips.