Inline PCB inspection system
* Information in this page is a reference that you created on the basis of information in the product catalog before the end of production, may be different from the current situation, such as goods for / supported standards options / price / features of the product. Before using, please check the compatibility and safety system.
last update: March 9, 2015
Image signal input unit | Imaging System | 5 M pixel camera/Telecentric Lens |
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Imaging Method | Color Highlight, 3D solder shape reconstruction | |
Resolution | 10 μm, 15 μm | |
Main unit | Feed method | Edge Belt Conveyor, Automatic Raid width Adjust |
Line height | 900 ±20 mm Adjustment from adjustable feet | |
PCB carrier width adjustment | Automatic | |
Power supply | 200 to 240 VAC (single phase) | |
Ambient operating temperature | +10 to +35 ℃ | |
Ambient operating humidity | 35 to 80% RH (with no condensation) | |
Weight | Approx. 500kg | |
Dimensions | 910 (W) × 1470 (D) × 1500 (H) mm |
Inspectable
PCBs |
Type | Post-reflow/Flow/Post-placement |
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Dimensions | Single lane: 50(W) × 50(D) to 510(W) × 610(D) mm
Dual lane: 50 (W) × 50(D) to 510 (W) × 300(D) mm |
|
Thickness | 0.4 to 4.0 mm | |
Clearance | Above PCB: 50 mm, Below PCB: 50 mm | |
Inspection items | Missing components, Wrong components, Component shifting (X/Y/skewing),
Fillets (wettability length, height, width of the tip, wettability angle, length of the side), Land exposure, Polarity shifting, Polarity lifting Solder balls, Bridging, Objects, Through hole, Polarity, Inversion |
|
Number of inspection points | 10,000 components/PCB max. |
last update: March 9, 2015