Industrial Automation

VT-X750

High-speed automated X-ray CT inspection system

VT-X750

In-line Full Inspection System

last update: February 13, 2024

Item		Description
Model		VT-X750		VT-X750-XL
Type		V3-H	V3-C	V3
Inspection object		BGA/CSP, inserted components, SOP, QFP, transistors, R/C chips, bottom-side terminal components, QFN, Power devices, POP, Press-fit CN, etc.
Inspection items		Void, open, non-wet, Solder Volume, shifting, foreign object, bridging, Solder fillet, TH Solder filling, Solder ball, etc. (selectable to applications)
Imaging system	Method	3D-slice imaging by using parallel CT
	Resolution	6,8,10,15,20,25,30µm/pixel (selectable in the inspection program)	3, 6,8,10,15,20,25,30µm/pixel (selectable in the inspection program)	10,15,20,25,30µm/pixel (selectable in the inspection program)
	X-ray source	Micro-fucus closed tube
	X-ray detector	Flat panel detector
PCBA	Size	50x50～610x515 mm (2x2 to 24x20 inch), Thickness：0.4～5.0 mm (0.4～3.0 mm in 3 µm resolution)		100x100～1200x660 mm, Thickness：0.4～15.0 mm
	Weight	Less than 4.0 kg, less than 8.0 kg (option)		Less than 15 kg
	Component clearance *Maximum	Top: 40 mm, 90 mm (option)		Top: 40 mm, Bottom: 50 mm
	Warpage	Less than 2.0 mm (Less than 1.0 ｍｍ in 3 µm resolution)		Less than 3.0 mm
Main body	Footprint	1,550(W) x 1,925(D) x 1,645(H) mm		2,180(W)×2,510(D)×1,735(H) mm
	Weight	Approx. 3,100 kg		Approx. 5,350 kg
	Conveyor height	900 ±20 mm
	Power supply	Single phase, 200 to 240 VAC, 50/60 Hz
	Rated power	2.4kVA		2.58kVA
	X-ray leakage	Less than 0.5 µSv/h
	Air supply	0.4 to 0.6 Mpa
	Safety standard	CE, SEMI, NFPA, FDA		CE, FDA

last update: February 13, 2024