Electric Vehicle Subassembly Solutions - Inspection of PCB Attachment to Power Inverter - OMRON Industrial Automation (MY)

Industrial Automation

Industrial Automation

Enhancing inspection of PCB attachment to power inverter

Omron’s innovative inspection technology recognizes the power module is a critical part of EV subassembly and allows for accuracy as well as speed when measuring each solder area during PCB attachment. Our solution improves inspection results while simultaneously optimizing product quality.

Challenge

For e-axle production, particularly inverter assembly, several layers of solder paste are required to increase conversion efficiency during the die bonding process. The area and thickness of these layers must be measured in order to achieve optimum product quality.

Solution

Automated inspection technology developed by Omron specifically for this task helps to improve results and bolster product quality. Omron’s VT-X750 3D CT X-RAY is capable of inspecting each layer of solder paste in a way that preserves the integrity of the product while prioritizing the quality of the inspection.

Fast x-ray inspection

Inspect several layers of solder paste condition and thickness by Full 3D CT inspection.

Related Products

Contact us today, and begin the process of revolutionizing your EV application

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