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Industrial Automation
VT-S530
PCB Inspection System
Omron's 3D-SJI (Solder Joint Inspection) Ensuring High-quality Products in an Efficient Manufacturing Environment
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last update: April 15, 2019
Hardware configuration
| Dimensions | 1180(W)×1640 (D)×1500(H) mm | |
|---|---|---|
| Weight | Approx. 850kg | |
| Power supply | Voltage | 200 - 240VAC (single phase),
voltage fluctuation range ±10% |
| Normal rated power | 2.0kVA | |
| Line height | 900±20mm | |
| Air supply pressure | 0.3 - 0.6MPa | |
| Operating temperature range | 10 - 35°C | |
| Operating humidity range | 35 - 80%RH (Non-condensing) | |
| Image signal
input block |
Imaging system | 12M pixel camera |
| Inspection principle | 3D reconstruction through color highlight and phase shift technology | |
| Image resolution | 10μm/15μm | |
| FOV | 10μ: 40×30mm | |
| 15μ: 60×45mm | ||
Functional specifications
| Supported PCB size (min.) | 50(W)×50(D)mm |
|---|---|
| Supported PCB size (max.) | Dual lane: 510(W)×330(D)mm |
| Single lane: 510(W)×680(D)mm | |
| Clearance | Above: 50mm; Below: 50mm |
| Height measurement range | 25mm |
| Thickness | 0.4 - 4mm |
| Inspection item | Component height, lift, tilt, missing/wrong
component, wrong polarity, flipped component, OCR inspection, 2D code, component offset (X/Y/rotation), fillet (height/length, end joint width, wetting angle, side joint length), exposed land, foreign material, land error, lead offset, lead posture, lead presence, solder ball, solder bridge |
last update: April 15, 2019
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